NEWS

Event at Comelec SA – 10 and 11 March 2020

together with IVAM, Comelec SA organizes (International Microtechnology Business Network) the first Focus Group meeting taking place in Switzerland.

Representatives from different institutions and companies active in the field of medical implants will be present on March 10th and 11th.
In this particularly demanding field, we will be able to discuss these advanced technologies and present some solutions.

If you are interested to join us, please register and find detailed information on:

https://www.ivam.de

EN9100 certification

COMELEC SA EUROPEAN LEADER IN PARYLENE TREATMENT IS PROUD TO ANNOUNCE ITS CERTIFICATION IN 9100: 2018. FOR ITS SERVICES OF SURFACE TREATMENT AND EQUIPMENT MANUFACTURING.

La Chaux de Fonds, June 2019.

The company announces the achievement of EN 9100: 2018 (Equivalent to AS9100: D and JIS 9100: 2016) certification for its surface treatment service activities as well as the design and manufacture of equipment related to Parylene technology. This certification integrate a quality approach turned resolutely towards excellence in order to better support the technological evolution of the aeronautical, space and defense markets. It also demonstrates the mastery of its special processes as well as a rigor in the means of control. Comelec is already listed in the OASIS (On Line Aerospace Suppliers Information Systems) database, which increases its visibility internationally. Finally, this certification rewards the work done by the entire COMELEC SA team and reinforces the know-how and professionalism that has been providing to you for 40 years.

The Parylene C is a food contact approved substance

We are glad to inform you that the Parylene C is a food contact approved substance and is registered through the FCN nr 001777 at the US Food and Drug Administration. This certification will enable you to consider this coating for pieces intended to use in direct or indirect contact with food stuff. The notification was effective on 17th August 2017 and now displayed in the authorized list at the fda website www.fda.gov. Our team is available to answer to all your questions. Please don’t hesitate to contact us by phone to the +41329240004 or by our contact form.

FREE STANDING PARYLENE MEMBRANES ARE NOW AVAILABLE !

Parylene films open new applications when used as a free standing membrane while keeping its outstanding properties.

Parylene is a polymer material which is biocompatible, hydrophobic, and resistant to the vast majority of organic solvents, strong acids and bases. It is elaborated without solvent from an original process known as Vapor Polymerization Deposition. Due to its strong penetration ability (ideal for complex 3D shapes) and its excellent barrier properties, Parylene coatings have been extensively used as an encapsulation material in various industries (electronic, medical, sensors, MEMS, etc). More recently, the use of free standing Parylene films opens new possibilities to further make use of these exceptional properties.

With an increasing demand for implantable devices, the medical industry presents a huge potential to make use of free standing Parylene. Indeed, Parylene films become more and more essential to the manufacturing of smart flexible devices (implantable electrodes, smart patches, etc…) able to adapt to movements of the human body. In this context, Comelec promoted this technology in the frame of the European project “Informed”. Combined with other materials and structuring technologies, applications are infinite.

The use of Parylene free standing films as membranes with tunable properties also represents an important source of applications, for example in the fields of gas detection or fluid filtration.

Comelec has developed a manufacturing process to produce these films in large quantities and with high thickness uniformity. The main commercial Parylene grades are already available as free standing films with thicknesses in the range 5 – 50 µm (others on request).

Depending on the customer, the Parylene films may be provided free standing or on silicon wafers (up to 200mm) for further post-processing (easily removable from silicon substrate by delamination or resist dissolving).