- Comelec SA
- Rue de la Paix 129
- Case postale 971
- CH-2301 La Chaux-de-Fonds
- Tel. +41 32 924 00 04
- Contact form
innovative encapsulation coating
Menu
INNOVATION
Comelec is now a part of
Comelec is now a part of
INNOVATION
Through a strategic partnership, EPFL became the main research partner of Comelec. Close collaboration, through Innosuisse innovation projects, enabled to develop the most advanced multilayer coatings from Comelec’s hybrid Parylene-inorganic process. This technology was well established in the Comelec product portfolio in 2019. Ongoing projects will focus on improving the technology readiness level addressing one of the most challenging application fields: long term active implantable medical devices (AIMDs).
www.epfl.ch/labs/lsbi/ from Prof. Stéphanie Lacour.
www.epfl.ch/labs/lpac/ from Prof. Véronique Michaud, Dr. Yves Leterrier and Dr. Pierre-Etienne Bourban.
2018-2021
The aim of the RELIEVE project is to provide a bioelectronic solution to relieve patients from chronic headaches through neuromodulation without the severe side effects that are common by using pharmaceuticals. The RELIEVE bioelectronic implantable system is so extremely miniaturized and flexible that it conforms to the patient’s anatomy and can be introduced during a short outpatient intervention. This is possible by replacing conventional bulk implant housings (metal, glass or ceramic cans) with an innovative soft encapsulation approach relying on Comelec’s advanced multilayer coating technologies.
2018-2021
This ambition of the project POSITION is to enable innovation in smart catheters and Implants by the introduction of open technology platforms for: miniaturization, in-tip AD conversion, wireless communication, MEMS transducer technology and encapsulation. These platforms are open to multiple users and for multiple applications. Comelec brings its expertise and innovative multilayer coatings technologies to address encapsulation challenges enabling the next AIMD generation.
2017-2020
XInoCaps is a Comelec SA / EPFL collaboration to develop Parylene/inorganic multilayer coatings with advanced barrier properties. These coatings combine Parylene C and inorganic thin films (from an ALD and / or PECVD process). This project allows for the improvement of hybrid multilayer coating equipment platforms developed by Comelec. Specifically, EPFL-LPAC (Laboratory for Processing of Advanced Composites) characterizes and models the multilayer structures to improve both mechanical behavior and barrier performances, EPFL-LSBI (Laboratory for Soft BioElectronic Interface) integrates and evaluates performances of these innovative coatings in electrically active devices towards development of flexible implants, EPFL-SPC (Swiss Plasma Center) focuses on plasma sources design.
The ultimate goal is to define multilayer stacks and procedures to encapsulate any device at low temperature and trigger the development of new miniaturized and flexible biomedical implants with improved lifetime and reliability.
2015-2018
The goal of the InForMed project was to establish an integrated pilot line for medical devices. The pilot line includes micro-fabrication, assembly and encapsulation. The heart of this chain is the micro-fabrication and assembly facility of Philips Innovation Services, which will be qualified for small/medium-scale production of medical devices. The pilot facility will be open to other users for pilot production and product validation. It is the aim of the pilot line: to safeguard and consolidate
Europe’s strong position in “traditional” medical diagnostic equipment, to enable emerging markets – especially in smart minimally invasive instruments and point-of-care diagnostic equipment – and to stimulate the development of entirely new markets, by providing an industrial micro-fabrication and assembly facility where new materials can be processed and assembled. The pilot line will be integrated in a complete innovation value chain from technology concept to high-volume production and system qualification. Protocols will be developed to ensure an efficient technology transfer between the different links in the value chain. In this context, the Parylene technology will be part of this pilot line by providing the final biocompatible encapsulation solution.
2011-2013
CLP project is a Swiss funded project (CTI – Commission for Technology and Innovation now Innosuisse) that had the aim of developing Conformal Layer Packaging (CLP) for smart neurosurgical implants. The main Comelec partners were Codman Sàrl and HE ARC (Prof. H. Keppner). A PhD student from University of Bern was devoted to investigating new medical applications on a joint project (“Development and Characterization of Ultrathin Layer Packaging for Implantable Device”). It was the starting point of multilayer technology.
Parylens: The main objective of this FP-7 European research project was to develop the next generation of optical lenses, based on an innovative concept inspired by the eyes of humans and of insects such as the fly.
Its basis was the joint He-ARC engineering/Comelec patent entitled “SOLID,” for SOLid on LIquid Deposition, which makes it possible to grow a Parylene film directly on a liquid. The film faithfully conforms to the liquid and encapsulates it. This project continue the work performed in the Multipol project.
Multipol: The objective for this FP-6 European research project was to obtain polymeric materials and multifunctional systems with specific mechanical, electrical, and optical characteristics. Based on the SOLID patent, the project’s major concept was the adjustment of parylene film properties through reaction with the liquid on which the film was deposited. The project succeeded in developing films with specific properties, and these results also led to significant progress in understanding the processes at work.